The Client has circuits that fail with burned chips on the board. We carefully investigated the schematics, layout and software and found design issues in software and part selection. Improper part selection was causing excessive heat buildup in the component capsule and PCB copper layers. In some of the cases the component that failed was the poor chosen one and in other cases, the component that failed was a power converter. In controlled environment we were able to reproduce the massive and rapid buildup of thermal energy and we were able to offer a different perspective to our Client. Analyzing the software we found improper transistor gate sequence was allowing p and n channel mos-fets to be open at the same time and generate a short. This short was responsible for the massive and rapid buildup of thermal energy. We made recommendations for alternative (pin to pin  compatible ) parts and we made recommendations for software changes. We documented and demonstrated the fixes recommended.